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A novel solvent-free method for the manufacture of biodegradable antibiotic-capsules for a long-term drug release using compression sintering and ultrasonic welding techniques

Paper ID Volume ID Publish Year Pages File Format Full-Text
12150 781 2005 8 PDF Available
Title
A novel solvent-free method for the manufacture of biodegradable antibiotic-capsules for a long-term drug release using compression sintering and ultrasonic welding techniques
Abstract

This report was to develop a novel solvent-free method for the manufacture of biodegradable capsules for a long-term drug delivery. To manufacture an antibiotic capsule, polylactide–polyglycolide copolymers were pre-mixed with vancomycin. The mixture was then injection compression molded to form a cylinder with a cover of 8 mm in diameter. After the addition of gentamicin sulfate into the core, an ultrasonic welder was used to seal the capsule. An elution method and an high-performance liquid chromatography assay were employed to characterize the in vitro release rates of the antibiotics over a 30-day period. It was found that biodegradable capsules released high concentration of vancomycin and gentamicin (well above the minimum inhibition concentration) in vitro for the period of time needed to treat bone infection; i.e., 2–4 weeks. A bacterial inhibition test was carried out to determine the relative activity of the released antibiotics. The diameter of the sample inhibition zone ranged from 3 to 18 mm, which is equivalent to 16.7–100% of relative activity. By adopting this novel technique, we will be able to manufacture biodegradable capsules of various medicines for long-term drug delivery.

Keywords
Antibiotic capsules; PLGA; Compression sintering; Ultrasonic welding; In vitro elution; Bacterial inhibition
First Page Preview
A novel solvent-free method for the manufacture of biodegradable antibiotic-capsules for a long-term drug release using compression sintering and ultrasonic welding techniques
Publisher
Database: Elsevier - ScienceDirect
Journal: Biomaterials - Volume 26, Issue 22, August 2005, Pages 4662–4669
Authors
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Subjects
Physical Sciences and Engineering Chemical Engineering Bioengineering