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Assessment of thermal conductivity as a function of porosity in bread dough during proving

Paper ID Volume ID Publish Year Pages File Format Full-Text
19273 43056 2009 6 PDF Available
Title
Assessment of thermal conductivity as a function of porosity in bread dough during proving
Abstract

During the proving process, yeast fermentation in the aqueous phase of dough produces carbon dioxide which diffuses through the aqueous phase to the gas cell nuclei entrapped during dough mixing. CO2 evaporates to generate within gas cell nuclei an excess pressure that provides the driving force for dough expansion. As a result, the void fraction of the dough increases and thermal conductivity decreases. These two properties are of considerable interest because of their technological significance in breadmaking (specific volume and processing times). The aim of the present study was therefore to investigate experimentally the thermal conductivity and porosity evolutions of bread dough during the proving process. Apparent density and thermal conductivity of fermenting dough were experimentally determined as a function of fermentation time using the line-heat source probe and image analysis methods, respectively. Thermal conductivity values were observed in the range of 0.36–0.12 W m−1 K−1 and values of void fraction air between 6 and 78% at proving conditions of 35 °C and 95% HR for 100 min of fermentation time. According to experimental data, relationship between thermal conductivity λ and porosity ɛ could be adequately described by a nonlinear equation: λ(ɛ) = 0.421–0.134ɛ–0.219ɛ0.5.

Keywords
Bread dough; Proving; Thermal conductivity; Porosity
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Publisher
Database: Elsevier - ScienceDirect
Journal: Food and Bioproducts Processing - Volume 87, Issue 1, March 2009, Pages 17–22
Authors
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Subjects
Physical Sciences and Engineering Chemical Engineering Bioengineering
Get Full-Text Now
Don't Miss Today's Special Offer
Price was $35.95
You save - $31
Price after discount Only $4.95
100% Money Back Guarantee
Full-text PDF Download
Online Support
Any Questions? feel free to contact us